IPC-M-109 Component H ling Manual

　　元件处理手册

　　IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification Nonhermetic Solid State Surface Mount Devices

　　非密封固态表面贴装器件湿度/再流焊敏感度分类

　　IPC/JEDEC J-STD-033A H ling, Packing, Shipping an d Use of Moisture/Reflow Sensitive Surface Mount Devices

　　对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用

　　IPC/JEDEC J-STD-035 Acoustic Microscopy Non-Hermetic Encapsulated Electronic Components

　　非气密封装电子元件用声波显微镜

　　IPC-DRM-18G Component Identification Desk Reference Manual

　　零件分类标识手册

　　IPC-DRM-smt-C Surface Mount Solder Joint evaluation Desk Reference Manual

　　接插件焊接点评价手册

　　IPC-DRM-40E Through-Hole Solder Joint evaluation Desk Reference Manual

　　接插件焊接点评价手册

　　IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual

　　导线和端子预成形参考手册

　　IPC-DRM-53 Introduction to Electronics Assembly Desk Reference Manual

　　电子组装基础介绍手册

　　IPC-M-103 St ards Surface Mount Assemblies Manual

　　所有SMT标准合订本

　　IPC-M-104 St ards Printed Board Assembly Manual

　　10种常用印制板组装标准合订本

　　IPC-TA-722 Technology Assessment of Soldering

　　锡焊技术精选手册

　　IPC-TA-723 Technology Assessment H book on Surface Mounting

　　表面安装技术精选手册

　　IPC-TA-724 Technology Assessment Series on Clean Rooms

　　清洁室技术精选系列

　　IPC-SM-780 Component Packaging a nd Interconnecting with Emphasis on Surface Mounting

　　以表面安装为主的元件封装及互连导则

　　IPC-SM-785 Guidelines Accelerated Reliability Testing of Surface Mount Attachments

　　表面安装焊接件加速可靠性试验导则

　　IPC-9701 Per mance Test Methods a nd Qualification Requirements Surface Mount Solder Attachments

　　表面安装锡焊件性能试验方法与鉴定要求

　　IPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level Interconnects

　　平板互连的单一弯曲特性

　　IPC-PD-335 Electronic Packaging H book

　　电子封装手册

　　IPC-7525 Stencil Design Guidelines

　　网版设计导则

　　IPC-QL 365A Certification of Facilities That Inspect/Test Printed Boards, Components a nd Materials

　　印制板, 元件和材料检验/试验企业的授证

　　IPC-9191 General Guidelines Implementation of Statistical Process Control

　　统计过程控制导则

　　IPC-TR-581 IPC Phase III ControlLED Atmosphere Soldering Study

　　IPC第3阶段受控气氛焊接研究

　　IPC-MI-660 Incoming Inspection of Raw Materials Manual

　　原材料接收检验手册

　　IPC/EIA J-STD-004A Requirements Soldering Fluxes-Includes Amendment 1

　　锡焊焊剂要求(包括修改单1)

　　IPC/EIA J-STD-005 Requirements Soldering Pastes-Includes Amendment 1

　　焊膏技术要求(包括修改单1)

　　IPC-HDBK-005 Guide to Solder Paste Assessment

　　焊膏性能评价手册

　　IPC/EIA J-STD-006A Requirements Electronic Grade Solder Alloys a nd Fluxed a nd Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求

　　IPC-SM-817 General Requirements Dielectric Surface Mounting Adhesives

　　表面安装用介电粘接剂通用要求

　　ELEC-SOLDER Modern Solder Technology Competitive Electronics Manufacturing

　　电子制造的最新焊接技术

　　IPC-WP-006 Round Robin Testing & Analysis: Lead-Free Alloys-Tin, Silver, & Copper

　　无铅焊料合金锡-银-铜的试验和分析求

　　IPC-CA-821 General Requirements Thermally Conductive Adhesives

　　导热胶粘剂通用要求

　　IPC-3406 Guidelines Electrically Conductive Surface Mount Adhesives

　　表面贴装导电胶使用指南

　　IPC-3408 General Requirements Anisotropically Conductive Adhesives Films

　　各向异性导电胶膜的一般要求

　　IPC-CC-830B Qualification a nd Per mance of Electrical Insulating Compound Printed Wiring Assemblies

　　印制板组装电气绝缘性能和质量手册

　　IPC-HDBK-830 Guideline Design, Selection a nd Application of Con mal Coatings

　　敷形涂层的设计，选择和应用手册

　　IPC-SM-840C Qualification a nd Per mance of Permanent Solder Mask - Includes Amendment 1

　　永久性阻焊剂的鉴定及性能(包括修改单1)

　　IPC-HDBK-840 Guide to Solder Paste Assessment

　　焊膏性能评价手册

　　ELEC-MICRO H book of Lead Free Solder Technology Microelectronic Assemblies

　　微电子组装无铅焊接技术手册

　　IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001

　　基于J-STD-001组装工艺雷氏选择法

　　IPC-AJ-820 Assembly & Joining Ha ndbook

　　装联手册

　　IPC-7530 Guidelines Temperature Profiling Mass Soldering (Reflow & Wave) Processes

　　大规模焊接(回流焊与波峰焊)过程温度曲线指南

　　IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes

　　新型助焊剂雷氏选择法

　　IPC-TP-1115 Selection Implementation Strategy a Low-Residue No-Clean Process

　　低残留不清洗工艺的选择和实施

　　IPC-S-816 SMT Process Guideline & Checklist

　　表面安装技术过程导则及检核表

　　IPC-TR-460A Trouble-Shooting Checklist Wave Soldering Printed Wiring Boards

　　印制板波峰焊故障排除检查表

　　IPC-CM-770E Component Mounting Guidelines Printed Boards

　　印制板元件安装导则

　　IPC-7912A Calculation of DPMO & Manufacturing Indices Printed Board Assemblies

　　印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算

　　IPC-9261 In-Process DPMO Estimated Yield PWAs

　　印制板组装过程中每百万件缺陷数(DPMO)及合格率估计

　　IPC-DPMO-202 IPC-7912/9261 End Item In Process DPMO Set

　　IPC-7912A 和IPC-9261合订本

　　IPC-9500-K Assembly Process Component Simulations, Guidelines & Classifications Package

　　组装过程中元件仿真, 规则分类

　　IPC-9501 PWB Assembly Process Simulation evaluation of Electronic Components 电子元件的印制板组装过程模拟评价

　　IPC-9502 PWB Assembly Soldering Process Guideline Electronic Components 电子元件的印制板组装焊接过导则

　　IPC-9503 Moisture Sensitivity Classification Non-IC Components 非集成电路元件的湿度敏感度分级

　　IPC-9504 Assembly Process Simulation evaluation of Non-IC Components (Preconditioning Non-IC Components)

　　非集成电路元件的组装过程模拟评价(非集成电路元件预处理)

　　IPC-9850-K Surface Mount Placement Equipment Characterization-KIT

　　表面贴装设备性能检测方法的描述(附Gerber格式CD盘)

　　IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit Surface Mount Placement Equipment St ardization

　　表面贴装设备性能测试用的标准工具包

　　• 4 IPC-9850 Placement Accuracy Verification Panels

　　• 1 IPC-9850 CMM Measurement Verification Panels

　　• 150 IPC-9850 QFP-100 Glass Components

　　• 130 IPC-9850 QFP-208 Glass Components

　　• 150 IPC-9850 bga-228 Glass Components

　　• NIST Traceable Measurement Certificate

　　• Custom Storage Case

　　IPC-7711/21A 电子组装件的返工与返修

　　IPC/EIA J-STD-002B Solderability Tests Component Leads, Terminations, Lugs, Terminals Wires

　　元件引线、端子、焊片、接线柱及导线可焊性试验

　　IPC/EIA J-STD-003A Solderability Tests Printed Boards

　　印制板可焊性试验

　　IPC-TR-461 Trouble-Shooting Checklist Wave Soldering Printed Wiring Boards

　　印制板波峰焊故障排除检查表

　　IPC-TR-462 Solderability evaluation of Printed Boards with Protective Coatings Over Long-term Storage

　　带?；ば酝坎阌≈瓢宄て谥娴目珊感云兰?/p>

　　IPC-TR-464 Accelerated Aging Solderability evaluations

　　可焊性加速老化评价(附修订)

　　IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability

　　蒸汽老化器温度控制稳定性联合试验

　　IPC-TR-465-2 The Effect of Steam Aging Time a nd Temperature on Solderability Test Results

　　蒸汽老化时间与温度对可焊性试验结果的影响

　　IPC-TR-465-3 evaluation of Steam Aging on Alternative Finishes, Phase IIA

　　替代涂覆层的蒸汽老化评价

　　IPC-TR-466 Technical Report: Wetting Balance St ard Weight Comparison Test

　　技术报告: 润湿天平称重标准对比测试

　　SMC-WP-001 Soldering Capability White Paper Report

　　可焊性工艺导论

　　SMC-WP-005 PCB Surface Finishes

　　印制电路板表面清洗