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smt技术
SMT零件识别(SMT Components Distinguish)(二)
本文关键字：
2.2 TSOP(Thin Small Outline Package): IC脚与SOP相同, 但本体厚度较SOP薄。 TSOP(Thin Small Outline Package): The shape is similar to SOP, but it’s thinner than SOP.
2.3 SOJ(Small Outline J-leaded Package): IC脚位于本体两侧, 呈J型向内弯曲。SOJ(Small Outline J-leaded Package): IC leads are J-shape and locate in 2 sides of body.
2.4 bga(Ball Grid Array): IC脚呈球状, 位于电路板(PCB)正下方。
2.5 μbga(Micro Ball Grid Array): IC脚呈球状, 位于芯片(Chip)正下方, 无电路板(PCB)。 μbga(Micro Ball Grid Array): IC leads are solder ball and in the bottom side of chip, no PCB in μbga.
2.6 QFP(Quad Flat Package): IC脚位于本体四边, 呈L型向外延伸。QFP(Quad Flat Package): IC leads are L-shape and locate in 4 sides of b12/1/2008ody.
2.7 PLCC(Plastic Leaded Chip Carrier): IC脚位于本体四边, 呈J型向内弯曲。PLCC(Plastic Leaded Chip Carrier): IC leads are L-shape and locate in 4 sides of body.
PTH零件识别(PTH Components Distinguish)
一 电阻(Resistor)
PTH电阻之色码代表意义如下:The meaning of color bar in PTH resistor is as below: